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Modelling considerations for stress intensity factor solutions at pin-loaded holes

机译:销孔中应力强度因子解决方案的建模考虑

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This work summarizes investigations into stress intensity factor solutions for straight, through cracks at pin-loaded holes in thin sheets. As shown in this work, several assumptions contribute to the fidelity of a stress intensity factor solution that includes the distribution of contact pressure on the pin-hole interface, the friction coefficient at the pin-hole interface, the crack initiation angle, and stiffness mismatch. These assumptions lead to higher or lower stress intensity factor solutions as demonstrated by results generated from advanced finite element analyses of the relevant geometries. Results shown here contribute to the development of a realistic and conservative set of assumptions for stress intensity factor solutions. Conclusions drawn from this work are applicable to cracks originating at pin-loaded holes in plates and lugs.
机译:这项工作总结了对直的应力强度因子解决方案的研究,该应力强度因子解决方案是通过薄板中的销钉加载孔中的裂纹实现的。如这项工作所示,一些假设有助于应力强度因子解的保真度,包括针孔界面上的接触压力分布,针孔界面处的摩擦系数,裂纹起始角和刚度不匹配。这些假设导致较高或较低的应力强度因子解决方案,相关几何的高级有限元分析所产生的结果证明了这一点。此处显示的结果有助于为应力强度因子解建立一组现实且保守的假设。从这项工作得出的结论适用于源自板和凸耳中销孔的裂纹。

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