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Electrical properties and deep traps spectra in undoped and Si-doped m-plane GaN films

机译:未掺杂和硅掺杂的m面GaN膜的电学性质和深阱谱

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摘要

Structural and electrical properties of nonpolar m-GaN films grown on m-SiC using standard metalorganic chemical vapor deposition (MOCVD) and two versions of sidewall epitaxial lateral overgrowth were studied. It is shown that lateral overgrowth allows one to dramatically reduce the dislocation density from over 10~9 cm~(-2) to ~10~7 cm~(-2). In good correlation with that we observed a strong reduction in the density of electron traps E_c-0.25 eV and E_c-0.6 eV from over 10~(15) cm~(-3) to ~10~(14) cm~(-3), respectively, in MOCVD m-GaN and in laterally overgrown m-GaN. Preliminary studies of the effects of changing the Ⅴ/Ⅲ ratio and of Si doping were performed. The MOCVD m-GaN films grown with high Ⅴ/Ⅲ ratio of 1000 were semi-insulating, with the Fermi level pinned near the 0.6 eV traps. Decreasing the Ⅴ/Ⅲ value to 250 shifted the Fermi level upward, close to the level of the 0.25 eV traps. Si doping in laterally overgrown samples strongly suppressed the formation of major electron traps but enhanced the formation of hole traps near E_u + 0.9 eV. We also report on electrical properties of the GaN interface with the AlN buffer used to facilitate good quality growth on SiC. These properties are dominated by a high concentration of 0.15 eV traps.
机译:研究了使用标准金属有机化学气相沉积(MOCVD)在m-SiC上生长的非极性m-GaN膜的结构和电性能,以及两种版本的侧壁外延横向过生长。结果表明,横向过度生长可以使位错密度从10〜9 cm〜(-2)大大降低到〜10〜7 cm〜(-2)。与此相关的是,我们观察到电子陷阱E_c-0.25 eV和E_c-0.6 eV的密度从10〜(15)cm〜(-3)到10〜(14)cm〜(-3 )分别在MOCVD m-GaN和横向过度生长的m-GaN中。初步研究了改变Ⅴ/Ⅲ比和硅掺杂的影响。以5,000的高Ⅴ/Ⅲ比生长的MOCVD m-GaN薄膜是半绝缘的,费米能级固定在0.6 eV陷阱附近。将Ⅴ/Ⅲ值降低至250可使费米能级向上移动,接近0.25 eV陷阱的能级。横向掺杂的样品中的Si掺杂强烈抑制了主要电子陷阱的形成,但增强了E_u + 0.9 eV附近的空穴陷阱的形成。我们还报告了氮化镓界面与用于促进SiC上良好质量增长的AlN缓冲液的电性能。这些特性主要由0.15 eV陷阱的高浓度决定。

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  • 来源
    《Extremes》 |2009年第6期|611-619|共9页
  • 作者单位

    Institute of Rare Metals, B. Tolmachevsky, 5, Moscow 119017, Russia;

    Institute of Rare Metals, B. Tolmachevsky, 5, Moscow 119017, Russia;

    Institute of Rare Metals, B. Tolmachevsky, 5, Moscow 119017, Russia;

    Institute of Rare Metals, B. Tolmachevsky, 5, Moscow 119017, Russia;

    Institute of Rare Metals, B. Tolmachevsky, 5, Moscow 119017, Russia;

    Institute of Rare Metals, B. Tolmachevsky, 5, Moscow 119017, Russia;

    Department of Materials Science and Engineering, Meijo University, Nagoya 468-8502, Japan;

    Department of Materials Science and Engineering, Meijo University, Nagoya 468-8502, Japan;

    Semiconductor Materials Science Department, Moscow State Institute of Steel and Alloys, Leninsky Ave., 4, Moscow 119017, Russia;

    Semiconductor Materials Science Department, Moscow State Institute of Steel and Alloys, Leninsky Ave., 4, Moscow 119017, Russia;

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