Pushing Etch to the limit for the 45/32nm node

摘要

In the past, etch systems were able to achieve their process goals with relative ease. Modern and future etch process specifications will require current etch systems to perform at the very limits of their capabilities. Etch systems are typically designed to operate best within a specific process space, and many previously unseen process issues will develop when tools are pushed beyond their original design parameters. For this reason, we believe the 45/32nm node requires a new mask etch hardware set in order to accommodate the very difficult process results required.