Aerotech, Inc

摘要

The PlanarHD air-bearing stage has been designed specifically to maximise wafer processing throughput by providing up to 2 m/s scan velocity and 5 g acceleration. The design utilises a highly engineered mechanical structure that increases air-bearing stiffness and decreases moving mass. In addition, the locations of the centre of force and the centre of mass have been optimised to eliminate parasitic forces that can result in throughput reducing error motions.