Ensuring the reliability of electronic devices through non-destructive testing of specialty metals & materials

摘要

MANUFACTURERS of high-end semiconductor electronic products used in consumer, industrial, and military applications have long relied on precise testing methodologies to identify the location of defects such as voids, cracks, and the delamination of different layers within a microelectronic device, also known as a Chip. Manufacturers employ a range of other techniques: scanning acoustic microscopy (SAM), a non-invasive and non-destructive ultrasonic testing method, has become an industry standard to detect and analyze flaws during various chip production steps and in the final quality inspection after packaging. In addition, SAM is often utilized as a Failure Analysis method when needed to identify a specific root cause failure mechanism when a device fails during use.