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Optimization Of Electroless Copper Plating On Polyethylene Films Modified By Surface Grafting Of Vinyl Ether Of Monoethanolamine

机译:单乙醇胺乙烯基醚表面接枝改性聚乙烯膜化学镀铜工艺的优化

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摘要

Metallized plastics have recently received significant interest for their useful applications in electronic devices such as for integrated circuits, packaging, printed circuits and sensor applications. In this work the metallized films were developed by electroless copper plating of polyethylene films grafted with vinyl ether of monoethanoleamine. There are several techniques for metal deposition on surface of polymers such as evaporation, sputtering, electroless plating and electrolysis. In this work the metallized films were developed by electroless copper plating of polyethylene films grafted with vinyl ether of monoethanoleamine. Polyethylene films were subjected to gamma-radiation induced surface graft copolymerization with vinyl ether of monoethanolamine. Electroless copper plating was carried out effectively on the modified films. The catalytic processes for the electroless copper plating in the presence and the absence of SnCl2 sensitization were studied and the optimum activation conditions that give the highest plating rate were determined. The effect of grafting degree on the plating rate is studied. Electroless plating conditions (bath additives, pH and temperature) were optimized. Plating rate was determined gravimetrically and spectrophotometrically at different grafting degrees. The results reveal that plating rate is a function of degree of grafting and increases with increasing grafted vinyl ether of monoethanolamine onto polyethylene. It was found that pH 13 of electroless bath and plating temperature 40℃ are the optimal conditions for the plating process. The increasing of grafting degree results in faster plating rate at the same pH and temperature. The surface morphology of the metallized films was investigated using scanning electron microscopy (SEM). The adhesion strength between the metallized layer and grafted polymer was studied using tensile machine. SEM photos and adhesion measurements clarified that uniform and adhered deposits were obtained under optimum conditions.
机译:最近,金属化塑料因其在电子设备中的有用应用(例如集成电路,包装,印刷电路和传感器应用)而引起了极大的兴趣。在这项工作中,通过用单乙醇胺的乙烯基醚接枝的聚乙烯薄膜的化学镀铜来开发金属化薄膜。有几种用于在聚合物表面上沉积金属的技术,例如蒸发,溅射,化学镀和电解。在这项工作中,通过用单乙醇胺的乙烯基醚接枝的聚乙烯薄膜的化学镀铜来开发金属化薄膜。使聚乙烯膜与单乙醇胺的乙烯基醚进行γ辐射诱导的表面接枝共聚。在改性膜上有效地进行了化学镀铜。研究了在有和没有SnCl2敏化的情况下化学镀铜的催化过程,并确定了获得最高镀覆速率的最佳活化条件。研究了接枝度对镀覆速率的影响。优化了化学镀条件(浴添加剂,pH和温度)。在不同的接枝度下通过重量和分光光度法确定镀覆速率。结果表明,镀覆速率是接枝度的函数,并且随着单乙醇胺的乙烯基醚接枝到聚乙烯上的增加而增加。结果表明,化学镀液的pH值为13,电镀温度为40℃是电镀工艺的最佳条件。在相同的pH和温度下,接枝度的增加导致电镀速度加快。使用扫描电子显微镜(SEM)研究了金属化膜的表面形态。使用拉伸机研究了金属化层与接枝聚合物之间的粘合强度。 SEM照片和附着力测量结果表明,在最佳条件下可获得均匀且附着的沉积物。

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  • 来源
    《Eurasian chemico-technological journal》 |2007年第1期|63-69|共7页
  • 作者单位

    Central Metallurgical Research & Development Institute (CMRDI), Surface Protection &Corrosion Control Lab, P.O. 87 Hellwan, Cairo, Egypt;

    Reading School of Pharmacy, University of Reading, Whiteknights, PO Box 224, RG6 6AD Reading, United Kingdom;

    Kazakh National University, Department of Chemical Physics & Macromolecular Chemistry, Karasai Batyra 95, 050012 Almaty, Kazakhstan;

    Kazakh National University, Department of Chemical Physics & Macromolecular Chemistry, Karasai Batyra 95, 050012 Almaty, Kazakhstan;

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