机译:具有微囊化催化剂的助熔剂和混合底层填料的表征,适用期长
Components & Materials Research Laboratory, ETRI, Daejeon;
Components & Materials Research Laboratory, ETRI, Daejeon;
Department of Macromolecular Science and Engineering, Case Western Reserve University, Cleveland, USA;
Components & Materials Research Laboratory, ETRI, Daejeon;
Components & Materials Research Laboratory, ETRI, Daejeon;
Components & Materials Research Laboratory, ETRI, Daejeon;
Department of Mechanical & Design Engineering, Hongik University, Sejong;
Flip chip; underfill; micro-encapsulated catalyst; MEC; latent; pot life;
机译:具有微囊化催化剂的助熔剂和杂化底填料的表征,适用期长
机译:用于提高倒装芯片底部填充胶使用寿命的潜在催化剂体系的研究
机译:无机-有机杂化二氧化硅基锡(II)催化剂:一锅三组分曼尼希反应的合成,表征及应用
机译:用于提高底部填充胶使用寿命的潜在催化剂体系的研究
机译:具有粘弹性环氧树脂底部填充和点胶的表面贴装电子产品的数值分析。
机译:一锅CO2-DME转化CuZnZr /镁碱沸石杂化催化剂的原位FT-IR表征
机译:原位FT-IR Cuznzr / Ferriere杂交催化剂的一锅CO2-TO-DME转换表征