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首页> 外文期刊>IEEE Transactions on Components, Hybrids, and Manufacturing Technology >Electrostatic discharge (ESD) sensitivity of thin-film hybrid passive components
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Electrostatic discharge (ESD) sensitivity of thin-film hybrid passive components

机译:薄膜混合无源元件的静电放电(ESD)敏感性

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摘要

The electrostatic discharge (ESD) sensitivities of thin-film passive components from various hybrid integrated circuits (HICs) were characterized using two ESD standard models: the human body model (HBM) and the charge device model (CDM). It was found that thin-film Au conductors made with a minimum linewidth of 60 mu m were insensitive to ESD of 3000 V. Capacitors failed at HBM voltages as low as 300 V when tested following the specification that calls for multiple HBM discharges. However, this test procedure was not indicative of the capacitors' ESD robustness due to a cumulative effect of the capacitors' ESD charging voltages. Low-value resistors were sensitive to ESD voltages as low as 600 V. High-value resistors, when not RTV (room temperature vulcanized) encapsulated, were damaged due to arcing at lower ESD voltages than when encapsulated. On the basis of the experimental results and analysis, rules for ESD robust low-value resistors are recommended. Also, a new meander resistor design is proposed.
机译:使用两种ESD标准模型来表征来自各种混合集成电路(HIC)的薄膜无源组件的静电放电(ESD)敏感性:人体模型(HBM)和充电设备模型(CDM)。发现最小线宽为60μm的薄膜Au导体对3000 V的ESD不敏感。按照要求多次HBM放电的规范进行测试时,电容器在HBM电压低至300 V时会失效。但是,由于电容器的ESD充电电压的累积影响,该测试过程不能表示电容器的ESD耐用性。低值电阻器对低至600 V的ESD电压敏感。未封装RTV(室温硫化)的高值电阻器由于在比封装时低的ESD电压下起弧而损坏。根据实验结果和分析,建议使用ESD鲁棒低值电阻器的规则。此外,提出了一种新的曲折电阻设计。

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