Cosintering process for glass-ceramic/copper multilayer ceramic substrate

摘要

In order to improve the electrical performance of the substrate for 3081 mainframe computers, a new material system consisting of glass-ceramic and copper metallurgy was developed for the system 390/ES9000 computers. The glass-ceramic package for the system 390/ES9000 is made up of 63 layers of green sheets screened with copper thick film paste and laminated under pressure to form a green body. The authors describe the challenges and solutions in cosintering the glass-ceramic and copper to form a dense package with the desired mechanical and electrical properties. A steam sintering process that is based on sound theoretical principles has been developed. This process has allowed packaging of a low dielectric constant ceramic with a high conductivity copper conductor.