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Investigation of conduction mechanism in thick film resistors trimmed by the pulse voltage method

机译:用脉冲电压法修整厚膜电阻器的导电机理的研究

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The conduction mechanism of RuO/sub 2/-based thick-film resistor (TFR) trimmed by the pulse voltage trimming (PVT) method is discussed. The surface temperature distribution barely changed when power was applied to the TFR, moreover, no current crowding was found by results of scanning electron microscopy-voltage contrast (SEM-VC). The existence of electron traps in the TFR could not be detected from the results of temperature stimulus current (TSC) characteristics. The resistance value of the TFR increased at 600 degrees C and then decreased abruptly at 800 degrees C. It was supposed, therefore, that the heat stress accumulated in the TFR during the refiring process of the TFRs was relaxed by the thermal annealing due to the PVT. Consequently, the decrease in the resistivity of the TFR, after the PVT, was quite logical, if an increase in the number of conductive paths resulted when the conductive structure was modified in the TFR. In addition, frequency resistance characteristics of the TFRs qualitatively best fit the values predicted by the metal-insulator-metal model.
机译:讨论了通过脉冲电压微调(PVT)方法微调的RuO / sub 2 /基厚膜电阻器(TFR)的导电机理。当向TFR通电时,表面温度分布几乎没有变化,此外,通过扫描电子显微镜-电压对比(SEM-VC)的结果未发现电流拥挤。从温度刺激电流(TSC)特性的结果无法检测到TFR中电子陷阱的存在。 TFR的电阻值在600摄氏度时增加,然后在800摄氏度时突然下降。因此,可以认为,由于TFR的烧成过程,TFR烧制过程中积累在TFR中的热应力得以缓解。 PVT。因此,如果在TFR中修改导电结构时导致导电路径数量增加,则PVT之后TFR电阻率的下降是很合理的。此外,TFR的频率电阻特性在质量上最适合由金属-绝缘体-金属模型预测的值。

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