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首页> 外文期刊>IEEE Transactions on Components, Hybrids, and Manufacturing Technology >Finite-difference time-domain analysis of pulse propagation in multichip module interconnects
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Finite-difference time-domain analysis of pulse propagation in multichip module interconnects

机译:多芯片模块互连中脉冲传播的时域有限差分分析

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The application of the finite-difference-time-domain (FDTD) method to the electromagnetic characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes is demonstrated. The limitations of the method in finding transmission line propagation characteristics (i.e., characteristic impedance Z/sub 0/ and phase constant beta ) are investigated. An alternative approach for the characterization of MCM interconnects which exploits the capabilities of the FDTD method is suggested. This alternative approach uses the results from the FDTD method to extract the per unit length delay and approximate impulse response of the system. These results can be used to identify the effects of the perforated reference plane on signal propagation. The validity of the TEM approximation for signal propagation in realistic MCM structures is also examined.
机译:演示了有限差分时域(FDTD)方法在具有穿孔(网格)参考平面的多芯片模块(MCM)互连的电磁特性中的应用。研究了该方法在寻找传输线传播特性(即特性阻抗Z / sub 0 /和相位常数beta)方面的局限性。建议了一种利用FDTD方法的功能来表征MCM互连的替代方法。这种替代方法使用FDTD方法的结果来提取每单位长度的延迟和近似的系统脉冲响应。这些结果可用于识别穿孔参考平面对信号传播的影响。还检查了TEM逼近在实际MCM结构中信号传播的有效性。

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