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Iterative boundary element method for crack analysis of two-dimensional piezoelectric semiconductor

机译:二维压电半导体裂纹分析的迭代边界元方法

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摘要

Based on the well-developed boundary element methods for piezoelectric media and conductors, we present an iterative boundary element method to solve the boundary value problems in two-dimensional piezoelectric semiconductors (PSCs). The proposed method is verified by analyzing a piezoelectric semiconductor plate under multi-field load. Two typically important boundary value problems, a hole and a crack, are studied in PSC plates by using the proposed method. The stress concentration near the edge of an elliptical hole in a finite piezoelectric semiconductor plate is studied by using the single-domain boundary element method. Also, by using the sub-domain boundary element method, we analyzed how the mechanical load, electrical load, electric current density, and initial electron density affected the stress, electric displacement and electric current intensity factors near the crack tip.
机译:在完善的压电介质和导体边界元方法的基础上,我们提出了一种迭代边界元方法来解决二维压电半导体(PSC)中的边值问题。通过分析多场载荷下的压电半导体板验证了该方法的有效性。使用提出的方法,在PSC板上研究了两个典型的重要边值问题,即孔和裂纹。采用单畴边界元法研究了有限压电半导体板椭圆孔边缘附近的应力集中。此外,通过使用子域边界元方法,我们分析了机械载荷,电载荷,电流密度和初始电子密度如何影响裂纹尖端附近的应力,电位移和电流强度因子。

著录项

  • 来源
    《Engineering analysis with boundary elements》 |2017年第10期|87-95|共9页
  • 作者单位

    School of Mechanics and Engineering Science, Zhengzhou University, Zhengzhou, Henan, China;

    Henan Key Engineering Laboratory for Anti-fatigue Manufacturing Technology and School of Mechanical Engineering, Zhengzhou University, Zhengzhou, Henan, China;

    Henan Key Engineering Laboratory for Anti-fatigue Manufacturing Technology and School of Mechanical Engineering, Zhengzhou University, Zhengzhou, Henan, China;

    School of Mechanics and Engineering Science, Zhengzhou University, Zhengzhou, Henan, China,Henan Key Engineering Laboratory for Anti-fatigue Manufacturing Technology and School of Mechanical Engineering, Zhengzhou University, Zhengzhou, Henan, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Crack; Elliptical hole; Intensity factors; Iterative boundary element method; Piezoelectric semiconductors;

    机译:裂纹;椭圆孔强度因素;迭代边界元法;压电半导体;

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