机译:基于PSPice-COMSOL的3-D IGBT电源模块的电热 - 机械建模
Naval Univ Engn Natl Key Lab Sci & Technol Vessel Integrated Powe Wuhan 430033 Peoples R China;
Naval Univ Engn Natl Key Lab Sci & Technol Vessel Integrated Powe Wuhan 430033 Peoples R China;
Huazhong Univ Sci & Technol Sch Elect & Elect Engn Wuhan 430033 Peoples R China;
Naval Univ Engn Natl Key Lab Sci & Technol Vessel Integrated Powe Wuhan 430033 Peoples R China;
Naval Univ Engn Natl Key Lab Sci & Technol Vessel Integrated Powe Wuhan 430033 Peoples R China;
Naval Univ Engn Natl Key Lab Sci & Technol Vessel Integrated Powe Wuhan 430033 Peoples R China;
Finite-element method (FEM); insulated gate bipolar transistor (IGBT); lumped-charge physical model; multi-physical fields coupling; multi-timescale;
机译:具有实验验证的多芯片功率模块电热分析的3-D热成分模型
机译:六块IGBT功率模块的高频实验表征和建模
机译:大功率IGBT的高级电热Spice建模
机译:电力IGBT模块电热模型电路模拟
机译:开发多芯片IGBT功率电子模块的电热模型。
机译:基于新型Volterra k最近邻最优修剪极限学习机(VKOPP)模型的绝缘栅双极晶体管(IGBT)剩余寿命估算
机译:基于芯片温度模型的IGBT电源模块功率循环寿命估算
机译:大面积功率元件和多芯片功率模块的在态电热建模