Optimised stencil technology improves process yields

摘要

Continued miniaturisation of electronic components, including resistor and capacitor packages having shrunk from 1206 to 0201 formats, a reduction in physical size of more than 95%, and the probable introduction in some market sectors of 01005 discretes has resulted in a greater use of thinner stencils to achieve improved paste release for fine- pitch and small apertures.