Design Guidelines for Stencil Design using Regression Equation to Improve Yield after Reflow machine in Printed Circuit Assembly (PCA) Process

摘要

The complexity of Printed Circuit Assembly process is increasing day by day and causing productivity issues in the industry, introducing ultra fine pitch components (pitch less than 15mil) in PCA is a challenge to minimize risk of defects as solder short, dry solder. This paper is focusing on minimizing these defects.To optimize process to reduce these defects, major contribution is from screen-printing process where stencil design plays major role if considered other screen-printing parameters are optimized, on which this paper is focused on. During the initial Stage of Stencil design it is imperative to arrest these problems. Design of Stencil should comply with "IPC-7525A: Stencil Design Guidelines". This paper is set on guidelines to minimize the process complexities and issues in production using above standard.