Analysis techniques scratch the surface

摘要

The complexity of PCB manufacturing has increased dramatically over the last three decades, progressing from straightforward double-sided boards with 100% through-hole technology to highly-complex multi-layer PCB's with mixtures of through-hole, surface mount and chip-on-board configurations. Board layouts have consequently increased in density with tighter tolerances and decreased distances between electrical contacts. With this increase in complexity the possibility of manufacturing defects has also consequently increased. Typical causes of failure include: Board delamination, Component misalignment, Broken metal lines, Cold-solder joints and poor die bonding, Surface contamination by metal and ionic residues.