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InAlAs/InGaAs/InP HEMTs with high breakdown voltages using double-recess gate process

机译:采用双凹槽栅极工艺的高击穿电压InAlAs / InGaAs / InP HEMT

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摘要

The DC and RF performance of InAlAs/InGaAs/InP HEMTs fabricated using a double-recess gate process are reported. A gate-drain breakdown voltage as high as 16 V was observed. The HEMTs also exhibited a high source-drain breakdown voltage near pinchoff of 16 V and a low RF output conductance of 6 mS/mm. For a 1.4 mu m gate length, an intrinsic transconductance of 560 mS/mm and f/sub T/ and f/sub max/ values of 16 and 40 GHz, respectively, were achieved.
机译:报告了使用双凹槽栅极工艺制造的InAlAs / InGaAs / InP HEMT的DC和RF性能。观察到栅极-漏极击穿电压高达16V。 HEMT还在夹断附近表现出高的源极-漏极击穿电压16 V,RF输出电导低至6 mS / mm。对于1.4μm的栅极长度,本征跨导为560 mS / mm,f / sub T /和f / sub max /值分别为16 GHz和40 GHz。

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