...
机译:BV CEO sub> = 12 V和
NTT Device Innovation Center, NTT Corp., Atsugi, Japan;
III-V semiconductors; aluminium compounds; current density; gallium arsenide; heterojunction bipolar transistors; indium compounds; semiconductor doping; InGaAs-InAlGaAs-InP; doping level; double heterojunction bipolar transistors; effective depletion thickness; field buffer; frequency 470 GHz to 173 GHz; high breakdown voltage; high collector current density; high-speed performance; size 30 nm to 250 nm; voltage 12 V; wavelength 0.25 mum;
机译:f_(max)D 256 GHz和BV_(CEO)D 8.3 V的高击穿电压InGaAs / InP双异质结双极晶体管
机译:具有f _(max)= 325 GHz和BV_(CBO)= 10.6 V的THz InGaAs / InP双异质结双极晶体管
机译:f(t)= 170 GHz和f(max)= 253GHz的高击穿电压亚微米InGaAs / InP双异质结双极晶体管
机译:突变结InP / GaAsSb / InP双异质结双极晶体管,F / sub T /高达250 GHz,BV / sub CEO / <6 V
机译:基于N沟道InGaAsP-InP的倒置通道技术器件(ICT)的设计,制造和表征,用于光电集成电路(OEIC):双异质结光电开关(DOES),异质结场效应晶体管(HFET),双极倒置沟道场-效应晶体管(BICFET)和双极型反向沟道光电晶体管(BICPT)。
机译:INP / INGAASSB / INGAAS双异质结双极晶体管中发射极尺寸效应的研究
机译:基于sb的双异质结双极晶体管(DHBT),Fmax> 650 GHz,适用于340 GHz发送器