Packaging & Interconnections

摘要

Intended for host-to-card applications and networking or communications equipment, the HCI highrnpower series backplane and midplane connectors are available in 2- and 3-positionrnstand-alone modules. The connectors feature copper-alloy power contacts rated to 75 A per contact without exceeding a 30℃ temperature rise with no airflow.rnThe power contacts incorporate multiple points of contact, and individual contacts are surrounded on four sides by molded housing walls to protect against adjacent contacts from shorting.