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EMC of Semiconductor Packages. Layout Design and Interconnection of Packaged IC to Accomplish Electromagnetic Compatibility.

机译：半导体包装的EMC。包装IC实现电磁兼容性的布局设计与互连。

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Osami WADA;
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年度 1998
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1. HEMCUVI: a software package for the electromagnetic analysis and design of radiating systems on board real platforms [J] . Obelleiro F., Taboada J.M., Rodriguez J.L., IEEE Antennas & Propagation Magazine . 2002,第5期

机译：HEMCUVI：用于在实际平台上进行电磁分析和辐射系统设计的软件包
2. HEMCUVI: a software package for the electromagnetic analysis and design of radiating systems on board real platforms [J] . Obelleiro F., Taboada J.M., Rodriguez J.L., IEEE Antennas & Propagation Magazine . 2002,第5期

机译：HEMCUVI：用于在实际平台上进行电磁分析和辐射系统设计的软件包
3. HEMCUVI: a software package for the electromagnetic analysis and design of radiating systems on board real platforms [J] . Obelleiro F., Taboada J.M., Rodriguez J.L., IEEE Antennas & Propagation Magazine . 2002,第5期

机译：Hemcuvi：用于电磁分析和船上辐射系统的软件包
4. Tools for Broadband Electromagnetic Modeling of Power Semiconductor Packages and External Circuit Layouts [C] . Ivana Kovacevic-Badstuebner, Ulrike Grossner, Dan Popescu International Symposium on Power Semiconductor Devices and ICs . 2020

机译：功率半导体封装和外部电路布局的宽带电磁建模工具
5. Modeling and simulation of electromagnetic wave propagation in electronic packages. [D] . Xue, Danwei. 1997

机译：电子封装中电磁波传播的建模和仿真。
6. Assessment of mand selection for functional communication training packages. [O] . Lisa Winborn, David P Wacker, David M Richman, 2002

机译：评估功能沟通培训包的选拔需求。
7. EMC of Semiconductor Packages. Thermal Performance and EMC of Semiconductor Packages. [O] . Nobuo IWASE 1998

机译：半导体包装的EMC。半导体包装的热性能和EMC。
8. Apparatus and Methods for Cooling Semiconductor Integrated Circuit Chip Packages. [R] . Andry, P. S., Colgan, E. G. 2006

机译：用于冷却半导体集成电路芯片封装的装置和方法。

EMC of Semiconductor Packages. Layout Design and Interconnection of Packaged IC to Accomplish Electromagnetic Compatibility.

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