Packaging & Interconnections

摘要

The Fine Pitch bump adapter converts TSSOP, QFP, and other fine-pitch devices to any 0.4-mm fine-pitch bumped package or routing configuration. The adapter mounts to the PCB via raised 0.25-mm pads on bottom. On the component side, the adapter has pads that can accept devices with a pitch of 0.5 mm or greater, enabling signal routing. Other active or passive components can be added to the adapter using the open space available at the top of the adapter board. Available on tape-and-reel for high-speed SMT assembly, standard line, and trace spacing down to 0.076 mm. (64-lead adapter, from $25.60 - 15 days ARO.)