Microsectioning Assembled PCBs

摘要

The trend toward higher density PCBs populated with fine pitch devices has created a challenge to quality assurance and the microsec-tioning process. It is difficult to analyze the true construction of a solder joint by means of visual inspection alone. Many manufacturers are resorting to the destructive analysis (microsectioning) of first-run PCBs that have been assembled and soldered. Microsectioning also is performed to obtain a full cross-sectional view of connections that are suspect in assemblies that have failed electrical test.