Packaging Laser Diodes for Fiber Optic Transmission

摘要

In optoelectronic component assembly, the package accounts for 60 to 80 percent of current manufacturing expenses1. With the optical component market forecast to grow at a compound rate of 35 to 45 percent in the next three years, improvements in packaging and processes are critical to reducing costs in the optical network. Some of the key active components in the optical network are source lasers and pump lasers. An understanding of the factors that influence their yield, performance and reliability are essential to provide lower cost packaging and production solutions.