It's an ongoing challenge to develop specialized fabrication processes that cater to the semiconductor industry's ever-increasing integration requirements. It's not just one discipline, but a collection of many that must work in synergy and progress simultaneously to meet the goals of the circuit designers and consumers. Physics, chemistry, and electrical and mechanical engineering, in conjunction with materials science, modeling, mathematical analysis, and other tools, all must move forward concurrently to achieve the new process technology for the next generation of semiconductor devices. Above all, these developments must lay the foundation for future advancements, while providing a glimpse of the ICs to come down the road in the next couple of years.
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