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首页> 外文期刊>IEEE Transactions on Electron Devices >Activation energy of source-drain current in hydrogenated and unhydrogenated polysilicon thin-film transistors
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Activation energy of source-drain current in hydrogenated and unhydrogenated polysilicon thin-film transistors

机译:氢化和未氢化多晶硅薄膜晶体管中源漏电流的活化能

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摘要

The activation energy of the drain current in polysilicon thin-film transistors (TFTs) and the effects of hydrogenation on this energy are discussed. The activation energy data are fitted using different models of the density of states in the material. It is shown that a model which assumes a distribution of brand tail states and localized deep states can account for the activation energy data of unhydrogenated polysilicon TFTs. However, the activation energy data on hydrogenated TFTs cannot be explained with the band tail model. Instead, a simple model of deep states localized at the grain boundary can fit this data quite accurately. Also, it is shown that there is a characteristic kink in the activation energy data of the hydrogenated TFTs which is a signature of the location of the deep states relative to the valence band edge. Analysis indicates that these deep states are located approximately 0.36 eV from the valence band edge. This value is consistent with that obtained from absorption measurements using photothermal deflection spectroscopy.
机译:讨论了多晶硅薄膜晶体管(TFT)中漏极电流的激活能量以及氢化对该能量的影响。使用材料中状态密度的不同模型拟合活化能数据。结果表明,假定品牌尾态和局部深态分布的模型可以说明未氢化多晶硅TFT的活化能数据。然而,不能用带尾模型解释氢化TFT上的活化能数据。取而代之的是,位于晶粒边界的深状态的简单模型可以非常准确地拟合此数据。此外,还表明,在氢化的TFT的活化能数据中存在一个特征性的纽结,它是相对于价带边缘的深态位置的标志。分析表明,这些深态位于离价带边缘约0.36 eV的位置。该值与使用光热偏转光谱法从吸收测量获得的值一致。

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