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首页> 外文期刊>IEEE Transactions on Electron Devices >A high-speed and highly uniform submicrometer-gate BPLDD GaAs MESFET for GaAs LSIs
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A high-speed and highly uniform submicrometer-gate BPLDD GaAs MESFET for GaAs LSIs

机译:用于GaAs LSI的高速,高度均匀的亚微米级栅BPLDD GaAs MESFET

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The authors present formation conditions for ion-implanted regions of a GaAs buried p-layer lightly doped drain (BPLDD) MESFET that can improve short-channel effect, V/sub th/ uniformity, and FET operating speed, simultaneously. For 0.7- mu m gates, a Mg/sup +/ dose of 2*10/sup 12/ cm/sup -2/ at 300 keV and a Si/sup +/ dose of 2*10/sup 12/ cm/sup -2/ at 50 keV are suitable for the p layer and n' layer, respectively. A sigma V/sub th/ of 7 mV is realized. Gate-edge capacitance of the 0.7- mu m-gate BPLDD that consists of both overlap capacitance and fringing capacitance is successfully reduced to 0.5 fF/ mu m, which is about 50% of that of a non-LDD buried p-layer (BP) FET. Another parasitic capacitance due to the p-layer was found to have less effect on the speed than the gate-edge one. Consequently, the gate propagation delay time of the BPLDD can be reduced to 15 ps at power dissipation of 1 mW/gate, which is about 65% of that of a BP. Applying the 0.7- mu m-gate BPLDD to 16-kb SRAMs, the authors have obtained a maximum access time of less than 5 ns with a galloping test pattern.
机译:作者介绍了GaAs埋入p层轻掺杂漏极(BPLDD)MESFET的离子注入区域的形成条件,该条件可以同时改善短沟道效应,V / sub /均匀性和FET工作速度。对于0.7微米的浇口,在300 keV时Mg / sup + /剂量为2 * 10 / sup 12 / cm / sup -2 /,而Si / sup + /剂量为2 * 10 / sup 12 / cm / sup p层和n'层分别适用于50 keV下的-2 /。实现了7 mV的sigma V / sub th /。由重叠电容和边缘电容组成的0.7μm栅极BPLDD的栅极边缘电容已成功降低至0.5 fF /μm,约为非LDD埋入p层(BP)的50%。 )场效应管。已发现,由于p层引起的另一种寄生电容对速度的影响小于栅边缘的寄生电容。因此,在功耗为1 mW /栅极时,BPLDD的栅极传播延迟时间可以降低至15 ps,约为BP的65%。将0.7μm的m-gate BPLDD应用于16-kb的SRAM,使用疾驰的测试模式,获得的最大访问时间小于5 ns。

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