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首页> 外文期刊>IEEE Transactions on Electron Devices >The effects of H/sub 2/-O/sub 2/-plasma treatment on the characteristics of polysilicon thin-film transistors
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The effects of H/sub 2/-O/sub 2/-plasma treatment on the characteristics of polysilicon thin-film transistors

机译:H / sub 2 / -O / sub 2 /等离子体处理对多晶硅薄膜晶体管特性的影响

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摘要

The effects of H/sub 2/-plasma followed by O/sub 2/-plasma treatment on n-channel polysilicon thin-film transistors (TFTs) were investigated. It was found that the H/sub 2/-O/sub 2/-plasma treatment is more effective in passivating the trap states of polysilicon films than the H/sub 2/-plasma or O/sub 2/-plasma treatment only. Hence, it is more effective in improving the device performance with regard to subthreshold swing, carrier mobility, and the current ON/OFF ratio. It is also found that thermal annealing of plasma-treated devices increases the deep states but has no effect on the tail states of the devices.
机译:研究了H / sub 2 /-等离子体接着O / sub 2 /-等离子体处理对n沟道多晶硅薄膜晶体管(TFT)的影响。已经发现,H / sub 2 / -O / sub 2 /等离子体处理比仅H / sub 2 /等离子体或O / sub 2 /等离子体处理更有效地钝化多晶硅膜的陷阱态。因此,在亚阈值摆幅,载流子迁移率和电流通/断比方面,在改善器件性能方面更有效。还发现等离子体处理过的器件的热退火增加了深态,但对器件的尾态没有影响。

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