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Dynamic snap-back induced programming failure in stacked gate flash EEPROM cells and efficient remedying technique

机译:堆叠栅闪存EEPROM单元中的动态折回引起的编程失败和有效的补救技术

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摘要

A new kind of programming failure is reported in stacked gate Flash EEPROM cells and its remedying scheme is presented. The failure is observed under typical bit line (B/L) disturbance bias conditions but is different from the case of the drain turn-on induced leakage current over-burdening the charge pumping. Rather, its root cause is identified for the first time to be the dynamic snap back breakdown operative in the memory cell. This snap-back induced programming failure is shown effectively mitigated with the use of an appropriate series resistance in the source loop of the memory cell. The remedying role of the source series resistance is discussed.
机译:报道了一种堆叠栅闪存EEPROM单元中的新型编程故障,并提出了其解决方案。该故障是在典型的位线(B / L)干扰偏置条件下观察到的,但与漏极导通引起的漏电流使电荷泵过度负担的情况不同。而是,其根源首次被确定为是在存储单元中起作用的动态快速恢复击穿。通过在存储单元的源极环路中使用适当的串联电阻,可以有效缓解这种回跳引起的编程故障。讨论了源串联电阻的补救作用。

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