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Studies of multiplication process of a novel image intensifier of an amplified metal-oxide-semiconductor imager overlaid with electron-bombarded amorphous silicon

机译:电子轰击非晶硅覆盖的新型金属氧化物半导体成像器图像增强器的倍增过程研究

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摘要

We studied the multiplication process of a novel image intensifier (II) of an amplified metal-oxide-semiconductor (MOS) imager (AMI) overlaid with electron-bombarded amorphous silicon (a-Si), by Monte Carlo (MC) simulation. The electron bombardment gains (EB-gains) of MC simulation for acceleration voltages between 2 and 10 kV coincide well with the measured values. The threshold voltage of 2 kV is well explained in terms of Bethe's electron beam energy losses of the Al and Si/sub x/N/sub 1-x/ layers. The penetration depth of an electron beam of 10 kV is 0.83 /spl mu/m and supports an experimentally safe optimal target thickness (1.2-1.3 /spl mu/m). The standard deviation of lateral spread is 2198 /spl Aring/. The theoretical excess noise coefficient is 1.2 between 7 and 1.3 kV, which coincides exactly with the measured value.
机译:我们通过蒙特卡罗(MC)模拟研究了一种新型的图像增强器(II)的放大过程,该过程通过电子轰击非晶硅(a-Si)覆盖的放大金属氧化物半导体(MOS)成像器(AMI)来实现。在2到10 kV之间的加速电压下,MC模拟的电子轰击增益(EB增益)与测量值非常吻合。 Bethe的Al和Si / sub x / N / sub 1-x /层的电子束能量损失很好地解释了2 kV的阈值电压。 10 kV电子束的穿透深度为0.83 / spl mu / m,并支持实验上安全的最佳目标厚度(1.2-1.3 / spl mu / m)。横向扩展的标准偏差为2198 / spl Aring /。理论上的多余噪声系数在7到1.3 kV之间为1.2,与测量值完全一致。

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