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Analysis and design of distributed ESD protection circuits for high-speed mixed-signal and RF ICs

机译:高速混合信号和RF IC的分布式ESD保护电路的分析和设计

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摘要

Electrostatic discharge (ESD) protection devices can have an adverse effect on the performance of high-speed mixed-signal and RF circuits. This paper presents quantitative methodologies to analyze the performance degradation of these circuits due to ESD protection. A detailed S-parameter-based analysis of these high-frequency systems illustrates the utility of the distributed ESD protection scheme and the impact of the parasitics associated with the protection devices. It is shown that a four-stage distributed ESD protection can be beneficial for frequencies up to 10 GHz. In addition, two generalized design optimization methodologies incorporating coplanar waveguides are developed for the distributed structure to achieve a better impedance match over a broad frequency range (0-10 GHz). By using this optimized design, an ESD device with a parasitic capacitance of 200 fF attenuates the RF signal power by only 0.27 dB at 10 GHz. Furthermore, termination schemes are proposed to allow this analysis to be applicable to high-speed digital and mixed-signal systems.
机译:静电放电(ESD)保护设备可能会对高速混合信号和RF电路的性能产生不利影响。本文提出了定量方法,以分析由于ESD保护而导致的这些电路的性能下降。对这些高频系统的详细基于S参数的分析说明了分布式ESD保护方案的效用以及与保护设备相关的寄生效应的影响。结果表明,对于高达10 GHz的频率,四阶段分布式ESD保护可能是有益的。此外,还针对分布式结构开发了两种结合共面波导的通用设计优化方法,以在较宽的频率范围(0-10 GHz)上实现更好的阻抗匹配。通过使用这种优化设计,具有200 fF寄生电容的ESD器件在10 GHz时仅将RF信号功率衰减0.27 dB。此外,提出了端接方案以允许该分析适用于高速数字和混合信号系统。

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