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A Review of Core Compact Models for Undoped Double-Gate SOI MOSFETs

机译:未掺杂双栅极SOI MOSFET的核心紧凑模型综述

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In this paper, we review the compact-modeling framework for undoped double-gate (DG) silicon-on-insulator (SOI) MOSFETs. The use of multiple gates has emerged as a new technology to possibly replace the conventional planar MOSFET when its feature size is scaled to the sub-50-nm regime. MOSFET technology has been the choice for mainstream digital circuits for very large scale integration as well as for other high-frequency applications in the low-gigahertz range. But the continuing scaling of MOSFET presents many challenges, and multiple-gate, particularly DG, SOI devices seem to be attractive alternatives as they can effectively reduce the short-channel effects and yield higher current drive. Core compact models, including the analysis for surface potential and drain-current, for both the symmetric and asymmetric DG SOI MOSFETs, are discussed and compared. Numerical simulations are also included in order to assess the validity of the models reviewed
机译:在本文中,我们回顾了无掺杂双栅极(DG)绝缘体上硅(SOI)MOSFET的紧凑模型框架。当其特征尺寸缩小到50纳米以下时,使用多栅极已成为一种可能替代传统平面MOSFET的新技术。 MOSFET技术已成为主流数字电路(超大规模集成)以及低千兆赫兹范围内的其他高频应用的选择。但是MOSFET的持续缩放带来了许多挑战,多栅极,特别是DG SOI器件似乎是有吸引力的替代方案,因为它们可以有效地减少短沟道效应并产生更高的电流驱动。讨论并比较了核心紧凑模型,包括对称和非对称DG SOI MOSFET的表面电势和漏极电流分析。还包括数值模拟,以评估所审查模型的有效性

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