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A New Multipulse Technique for Probing Electron Trap Energy Distribution in High- $kappa$ Materials for Flash Memory Application

机译:一种用于探测高kappa $材料中电子陷阱能分布的多脉冲新技术,用于闪存应用

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摘要

A new discharge-based multipulse technique has been developed in this paper, which overcomes the shortcomings of the existing techniques, such as the charge pumping, charge injection and sensing, and two-pulse $C$–$V$ techniques. It captures the energy signature for electron traps across high-$ kappa$ materials and can be a useful tool for material selection during technology development. Trap distributions in $hbox{HfO}_{2}$, $hbox{Al}_{2}hbox{O}_{3}$, and HfAlO have been compared to identify the effects of material variation. It is observed that hafnium gives the shallow traps at about 0.45 eV above the silicon conduction band bottom (Si $E_{rm CB})$, and the deep traps at 0.8 eV below the Si $E_{rm CB}$ are caused by aluminum. HfAlO combines the features in $hbox{HfO}_{2}$ and $hbox{Al}_{2}hbox{O}_{3}$. A peak near the Si $E_{rm CB}$ has been observed in all the three materials.
机译:本文开发了一种新的基于放电的多脉冲技术,该技术克服了现有技术的缺点,例如电荷泵,电荷注入和传感以及两脉冲C $ – $ V $技术。它捕获了高kappa $材料上电子陷阱的能量特征,并且可以用作技术开发过程中材料选择的有用工具。比较了$ hbox {HfO} _ {2} $,$ hbox {Al} _ {2} hbox {O} _ {3} $和HfAlO中的陷阱分布,以识别材料变化的影响。据观察,ha在硅导带底部(Si $ E_ {rm CB})$上方约0.45 eV处产生浅陷阱,而在Si $ E_ {rm CB} $下方0.8 eV处的深陷阱由以下原因引起:铝。 HfAlO结合了$ hbox {HfO} _ {2} $和$ hbox {Al} _ {2} hbox {O} _ {3} $中的功能。在所有这三种材料中都观察到Si $ E_ {rm CB} $附近的峰。

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