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首页> 外文期刊>Electron Devices, IEEE Transactions on >Direct Measurement of Correlation Between SRAM Noise Margin and Individual Cell Transistor Variability by Using Device Matrix Array
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Direct Measurement of Correlation Between SRAM Noise Margin and Individual Cell Transistor Variability by Using Device Matrix Array

机译:通过使用器件矩阵阵列直接测量SRAM噪声裕度与各个单元晶体管可变性之间的相关性

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摘要

Noise margin, characteristics of six individual cell transistors, and their variability in static random-access memory (SRAM) cells are directly measured using a special device-matrix-array test element group of 16-kb SRAM cells, and the correlation between the SRAM noise margin and the cell transistor variability is analyzed. It is found that each cell shows a very different supply voltage $V_{dd}$ dependence of the static noise margin (SNM), and this scattered $V_{dd}$ dependence of the SNM is not explained by the measured threshold voltage $V_{rm th}$ variability alone, indicating that the circuit simulation taking only the $V_{rm th}$ variability into account will not predict the SRAM stability precisely at low supply voltage.
机译:噪声裕量,六个独立单元晶体管的特性及其在静态随机存取存储器(SRAM)单元中的变异性是使用16 kb SRAM单元的特殊设备矩阵矩阵测试元件组直接测量的,以及SRAM之间的相关性分析了噪声容限和单元晶体管的可变性。可以发现,每个单元显示的静态噪声容限(SNM)的电源电压$ V_ {dd} $依赖性很大,而测量的阈值电压$不能解释SNM的这种分散的$ V_ {dd} $依赖性。仅V_ {rm th} $可变性,表明仅考虑$ V_ {rm th} $可变性的电路仿真将无法精确预测低电源电压下的SRAM稳定性。

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