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Plasmon-Sensitized Optoelectronic Properties of Au Nanoparticle-Assisted Vertically Aligned TiO2 Nanowires by GLAD Technique

机译:GLAD技术对金纳米粒子辅助垂直排列的TiO2纳米线的等离子体增敏光电性能

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摘要

In this paper, the glancing angle deposition technique is used to fabricate Au nanoparticle-assisted vertically aligned TiO2 nanowires (Au-NP-TiO2-NW) on glass and Si substrates. The effect of annealing on the plasmonic resonance and optical properties of Au-NP-TiO2-NW are investigated by UV-visible absorption and photoluminescence spectroscopy. The field emission gun-scanning electron microscopy with energy dispersive spectroscopy analysis manifests the successful growth of Au-NP-TiO2-NW on Si substrate with the presence of Au, Titanium (Ti), Oxygen (O), and Silicon (Si) in the sample. The transmission electron microscope and X-ray diffraction analysis reveal the polycrystalline nature of the anatase TiO2-NW and Au-NPs with improved crystal quality after annealing. The rectifying behavior of Au-NP-TiO2-NW/Si-based photodetector device under forward bias in dark condition demonstrates the formation of p-n junction at the interface of Au-NP-TiO2-NW and p-Si. The photocurrent and dark current density recorded for the device at 4 V are ∼1.69×10−3 and ∼1.14×10−3 A/cm2, respectively. However, it is interesting to observe that an average ~60 folds photocurrent as compared with dark current with an excellent response time under the on/off switching of white light upon the device at −3 V, which confirms potential application in optoelectronics.
机译:在本文中,掠射角沉积技术用于在玻璃和Si基板上制造Au纳米粒子辅助的垂直排列的TiO2纳米线(Au-NP-TiO2-NW)。通过紫外可见吸收和光致发光光谱研究了退火对Au-NP-TiO2-NW的等离子体共振和光学性质的影响。场发射枪扫描电子显微镜的能量色散光谱分析表明,Au,钛(Ti),氧(O)和硅(Si)的存在使Au-NP-TiO2-NW在Si衬底上成功生长。例子。透射电子显微镜和X射线衍射分析揭示了锐钛矿型TiO2-NW和Au-NPs的多晶性质,退火后其晶体质量得到改善。基于Au-NP-TiO2-NW / Si的光电探测器在黑暗条件下在正向偏压下的整流行为表明在Au-NP-TiO2-NW / p-Si的界面处形成了p-n结。该器件在4 V电压下记录的光电流和暗电流密度分别为〜1.69×10-3和〜1.14×10-3 A / cm2。但是,有趣的是,与暗电流相比,平均电流约为60倍,在-3V电压下器件上的白光开/关切换时,响应时间极佳,这证实了其在光电领域的潜在应用。

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  • 来源
    《Electron Devices, IEEE Transactions on》 |2017年第3期|1127-1133|共7页
  • 作者单位

    Department of Electronics and Communication Engineering, Microelectronics & VLSI Design Group, National Institute of Technology Silchar, Silchar, India;

    Department of Electronics and Communication Engineering, National Institute of Technology Manipur, Imphal, India;

    Department of Electronics and Communication Engineering, Microelectronics & VLSI Design Group, National Institute of Technology Silchar, Silchar, India;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Annealing; Substrates; Absorption; Gold; Silicon; Photonic band gap;

    机译:退火;基底;吸收;金;硅;光子带隙;

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