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首页> 外文期刊>Electron Devices, IEEE Transactions on >Identification of Channel Hot Carrier Stress-Induced Oxide Traps Leading to Random Telegraph Signals in pMOSFETs
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Identification of Channel Hot Carrier Stress-Induced Oxide Traps Leading to Random Telegraph Signals in pMOSFETs

机译:识别通道热载体应力诱导的氧化物陷阱,导致PMOSFET中随机电报信号

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We investigated the effect of channel hot carrier (CHC) stressing on the creation of gate oxide defect centers causing random telegraph signals (RTSs) in pMOSFETs. To identify these stress-induced hole traps in the oxide and fully characterize their trapping properties, variable temperature RTS measurements were performed from room temperature down to 215 K and repeated after each stressing interval, up to 1200 s. The trapping properties of the stress-induced defect sites and those present before stress are quantified, including the hole capture and emission activation energies, structural relaxation in the oxide network due to trapping/detrapping, and entropy change as well as the energy level and position of the trap in the oxide. Based on this information, disassociated III-Si and hydrogen bridge defects are identified as the hole trapping centers in SiO 2 . Difference was observed between the process- and stress-induced traps in the entropy change upon hole emission from the oxide trap to Si channel (electron capture from the Si valence band), implying the possibility of stress-induced structural defects being different than the native ones.
机译:我们调查了通道热载体(CHC)强调对栅极氧化物缺陷中心的产生的影响,导致PMOSFET中随机电报信号(RTS)。为了鉴定氧化物中的这些应力诱导的孔阱并充分表征其捕获性能,可变温度RTS测量从室温下降到215 k并在每个应力间隔后重复,高达1200秒。应力诱导的缺陷位点的捕获性能和存在于应力之前的那些,包括空穴捕获和发射激活能量,由于捕获/脱节而导致的氧化物网络中的结构松弛,以及熵变化以及能量水平和位置陷阱在氧化物中。基于该信息,脱离III-Si和氢桥缺陷被识别为SIO 2 。在从氧化物疏水阀到Si通道的孔发射时,在熵改变的过程和应力引起的陷阱之间观察到差异(来自Si价带的电子捕获),暗示应力诱导的结构缺陷与天然不同的可能性那些。

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