首页> 外文期刊>IEEE Transactions on Electron Devices >An Improved 4H-SiC Trench-Gate MOSFET With Low ON-Resistance and Switching Loss
【24h】

An Improved 4H-SiC Trench-Gate MOSFET With Low ON-Resistance and Switching Loss

机译:具有低导通电阻和开关损耗的改进型4H-SiC沟道栅MOSFET

获取原文
获取原文并翻译 | 示例
       

摘要

In this paper, an improved 4H-SiC U-shaped trench-gate metal-oxide-semiconductor field-effect transistors (UMOSFETs) structure with low ON-resistance (R-ON) and switching energy loss is proposed. The novel structure features an added n-type region, which reduces ON-resistance of the device significantly while maintaining the breakdown voltage (V-BR). In addition, the gate of the improved structure is designed as a p-n junction to reduce the switching energy loss. Simulations by Sentaurus TCAD are carried out to reveal the working mechanism of this improved structure. For the static performance, the ON-resistance and the figure of merit (FOM = V-BR(2)/R-ON) of the optimized structure are improved by 40% and 44%, respectively, as compared to a conventional trench MOSFET without the added n-type region and modified gate. For the dynamic performance, the turn-on time (T-ON) and turn-off time (T-OFF) of the proposed structure are both shorter than that of the conventional structure, bringing a 43% and 30% reduction in turn-on energy loss and total switching energy loss (E-SW).
机译:本文提出了一种改进的4H-SiC U型沟槽栅金属氧化物半导体场效应晶体管(UMOSFET)结构,具有低导通电阻(R-ON)和开关能量损耗。新型结构的特点是增加了n型区域,可在保持击穿电压(V-BR)的同时显着降低器件的导通电阻。此外,改进结构的栅极设计为p-n结,以减少开关能量损失。 Sentaurus TCAD进行了仿真,以揭示这种改进结构的工作机理。为了获得静态性能,与传统的沟槽MOSFET相比,优化结构的导通电阻和品质因数(FOM = V-BR(2)/ R-ON)分别提高了40%和44%没有添加n型区域和修改的门。对于动态性能,建议结构的开启时间(T-ON)和关断时间(T-OFF)均比传统结构短,从而将转弯时间分别减少了43%和30%能量损耗和总开关能量损耗(E-SW)。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号