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首页> 外文期刊>IEEE Transactions on Electron Devices >A SPICE Compatible Compact Model for Hot-Carrier Degradation in MOSFETs Under Different Experimental Conditions
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A SPICE Compatible Compact Model for Hot-Carrier Degradation in MOSFETs Under Different Experimental Conditions

机译:在不同实验条件下MOSFET热载子降解的SPICE兼容紧凑模型

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A compact hot-carrier degradation (HCD) time kinetics model is proposed for conventional, lightly doped drain, and drain extended MOSFETs and FinFETs. It can predict measured data obtained using different methods such as shift in threshold voltage (Delta V-T), linear (Delta I-DLIN) and saturation (Delta I-DSAT) drain current, and charge pumping current (Delta I-CP), for off- and on-state stress conditions. The influences of the gate (V-G) and drain (V-D) bias for large V-D range and wide V-G/V-D combinations, temperature (T), and channel length (L-CH) have been analyzed. The impact of L-CH variation on V-G dependence of HCD has been modeled. The model parameters are listed for different devices.
机译:针对常规的轻掺杂漏极和漏极扩展的MOSFET和FinFET,提出了紧凑的热载流子退化(HCD)时间动力学模型。它可以预测使用不同方法获得的测量数据,例如阈值电压(Delta VT),线性(Delta I-DLIN)和饱和(Delta I-DSAT)漏极电流以及电荷泵浦电流(Delta I-CP)的偏移,断态和通态应力条件。分析了大V-D范围和宽V-G / V-D组合,温度(T)和沟道长度(L-CH)的栅极(V-G)和漏极(V-D)偏置的影响。 L-CH变化对HCD的V-G依赖性的影响已被建模。列出了针对不同设备的型号参数。

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