首页> 外文期刊>IEEE Electron Device Letters >Improving radiation hardness of EEPROM/flash cell by N/sub 2/O annealing
【24h】

Improving radiation hardness of EEPROM/flash cell by N/sub 2/O annealing

机译:通过N / sub 2 / O退火提高EEPROM /闪存单元的辐射硬度

获取原文
获取原文并翻译 | 示例
获取外文期刊封面目录资料

摘要

The effects of an N/sub 2/O anneal on the radiation effects of a split-gate electrical erasable programmable read only memory (EEPROM)/flash cell with a recently-proposed horn-shaped floating gate were studied. We have found that although the cells appear to survive 1 Mrad(Si) Co/sup 60/ irradiation without data retention failure, the write/erase cycling endurance was severely impeded after irradiation. Specifically, the write/erase cycling endurance was degraded to 20 K from the pre-irradiation value of 50 K. However, by adding an N/sub 2/O annealing step after the interpoly oxidation, the after-irradiation write/erase cycling endurance of the resultant cell can be significantly improved to over 45 K. N/sub 2/O annealing also improves the after-irradiation program and erase efficiencies. The N/sub 2/O annealing step therefore presents a potential method for enhancing the robustness of the horn-shaped floating-gate EEPROM/flash cells for radiation-hard applications.
机译:研究了N / sub 2 / O退火对具有最近提出的角状浮栅的分裂栅电可擦可编程只读存储器(EEPROM)/闪存单元的辐射效应的影响。我们发现,尽管细胞似乎在1 Mrad(Si)Co / sup 60 /辐照下存活而没有数据保留失败,但是辐照后,写入/擦除循环的耐久性受到严重阻碍。具体而言,写入/擦除循环耐力从辐照前的50 K降低到20K。但是,通过在多晶间氧化后添加N / sub 2 / O退火步骤,照射后写入/擦除循环耐力N / sub 2 / O退火还可以改善后辐照程序和擦除效率。因此,N / sub 2 / O退火步骤提供了一种潜在的方法,可增强用于辐射坚硬应用的角形浮栅EEPROM /闪存单元的坚固性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号