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首页> 外文期刊>IEEE Electron Device Letters >Performance dependence of InGaP/InGaAs/GaAs pHEMTs on gate metallization
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Performance dependence of InGaP/InGaAs/GaAs pHEMTs on gate metallization

机译:InGaP / InGaAs / GaAs pHEMT对栅极金属化的性能依赖性

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摘要

The performance of InGaP-based pHEMTs as a function of gate metallization is examined for Mo/Au, Ti/Au, and Pt/Au gates. DC and microwave performance of pHEMT's with 0.7-/spl mu/m gate lengths is evaluated. Transconductance, threshold voltage, f/sub t/, and f/sub max/ are found to depend strongly on gate metallization. High-speed performance is achieved, with f/sub t/ of 41.3 GHz and f/sub max/ of 101 GHz using Mo/Au gates. The difference in performance between devices with different gate metallizations is postulated to be due to a combination of the difference in Schottky barrier heights and different gate-to-channel spacings due to penetration of the gate metal into the InGaP barrier layer.
机译:对于Mo / Au,Ti / Au和Pt / Au栅极,研究了基于InGaP的pHEMT作为栅极金属化性能的性能。评估了门极长度为0.7- / spl mu / m的pHEMT的直流和微波性能。发现跨导,阈值电压,f / sub t /和f / sub max /很大程度上取决于栅极金属化程度。使用Mo / Au门,f / sub t /为41.3 GHz,f / sub max /为101 GHz,可实现高速性能。假设具有不同栅极金属化的器件之间的性能差异是由于肖特基势垒高度的差异和由于栅极金属渗透到InGaP势垒层中而导致的不同栅-沟道间距的结合所致。

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