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首页> 外文期刊>IEEE Electron Device Letters >The Investigation of Post-Annealing-Induced Defects Behavior on 90-nm In Halo nMOSFETs With Low-Frequency Noise and Charge-Pumping Measuring
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The Investigation of Post-Annealing-Induced Defects Behavior on 90-nm In Halo nMOSFETs With Low-Frequency Noise and Charge-Pumping Measuring

机译:用低频噪声和电荷泵测量研究Halo nMOSFET中90nm的退火后诱导的缺陷行为

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In this letter, we investigated the effects of post-annealing on indium (In) halo-induced defects for 90-nm nMOSFETs with both low-frequency noise and charge-pumping (CP) current measuring methods. The noise in In halo devices with and without a post-annealing is lower and higher than that in Boron-halo devices, respectively. Additionally, with increase of annealing time, the noise is decreased for the measuring frequency less than 1 kHz due to the efficient elimination of oxide defects. For frequency larger than 1 kHz, the longer annealing time induces a larger quantity interface defects thus enhancing the generation of noise in high frequency. The results are nicely supported by the measurements of gate integrity and CP currents
机译:在这封信中,我们使用低频噪声和电荷泵(CP)电流测量方法研究了90纳米nMOSFET的后退火对铟(In)晕圈引起的缺陷的影响。带有和不带有后退火的In Halo器件中的噪声分别低于和高于Boron-halo器件中的噪声。另外,随着退火时间的增加,由于有效消除了氧化物缺陷,对于小于1 kHz的测量频率,噪声降低了。对于大于1 kHz的频率,较长的退火时间会引起大量的界面缺陷,从而增强高频噪声的产生。栅极完整性和CP电流的测量很好地支持了结果

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