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Direct Monitoring of RF Overstress in High-Power Transistors and Amplifiers

机译:直接监视大功率晶体管和放大器中的RF过应力

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摘要

Light emission from power transistors at a compression level in the range of 2–3 dB has been imaged using a microscope-mounted camera. Results show that the emitted light intensity distribution across the transistor is highly nonuniform and depends on the load impedance, direct current, and RF conditions. The light intensity correlates with a negative gate current, which is a result of the RF-induced impact ionization in the transistors. The nonuniformity in the light intensity is attributed to the RF-induced voltage overstress in the transistors. The observed light emission may be used as a direct and contactless monitor of the RF-induced overstress in transistors and power amplifiers.
机译:使用显微镜安装的摄像头可以对功率晶体管在2–3 dB压缩范围内的发光进行成像。结果表明,跨晶体管的发射光强度分布非常不均匀,并且取决于负载阻抗,直流电和RF条件。光强度与负栅极电流相关,这是晶体管中RF感应的碰撞电离的结果。光强度的不均匀性归因于晶体管中RF感应的电压过应力。观察到的光发射可用作晶体管和功率放大器中RF感应过应力的直接和非接触式监视器。

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