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首页> 外文期刊>IEEE Electron Device Letters >Effects of Oxidants on the Bias-Stress Instabilities of In-Ga-Zn-O Thin Film Transistors Using HfO2 Gate Insulator Prepared by Atomic Layer Deposition
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Effects of Oxidants on the Bias-Stress Instabilities of In-Ga-Zn-O Thin Film Transistors Using HfO2 Gate Insulator Prepared by Atomic Layer Deposition

机译:用原子层沉积制备的HFO2栅极绝缘体氧化剂对In-Zn-O薄膜晶体管偏置应力稳定性的影响

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摘要

We fabricated the In-Ga-Zn-O thin-film transistors using HfO2 gate insulator prepared by atomic-layer deposition with different oxidants of H2O and O-3 at 200 degrees C. While the device using H2O showed almost no change in threshold voltage (V-th) even after $10<^>{{4}}$ s with bias-stresses, the device using O-3 showed the V-th shifts of -1.4 and +1.2 V under positive and negative bias stresses, respectively. Defect-related carrier generation model was suggested as a physical origin for the anomalous bias-stress instabilities and the related mechanisms, in which the incorporated hydrogens can interact with oxygen-related defects.
机译:我们使用用HFO2栅极绝缘体制造了In-Ga-Zn-O薄膜晶体管,其通过原子层沉积,其中H2O和O-3的不同氧化剂,在200℃下。使用H2O的装置表示几乎没有阈值电压的变化(第V-Th)即使在具有偏压的10美元{{4}} $ s之后,使用O-3的设备分别在正和负偏压应力下显示-1.4和+1.2V的第V班。缺陷相关的载体生成模型被提出为异常偏压稳定性和相关机制的物理来源,其中掺入的氢氢可与氧有关的缺陷相互作用。

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