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首页> 外文期刊>IEEE Transactions on Electromagnetic Compatibility >An ICIM-CI-T Model for EMI Prediction of IO Element on Typical FPGA With Temperature Effect Considered
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An ICIM-CI-T Model for EMI Prediction of IO Element on Typical FPGA With Temperature Effect Considered

机译:一种ICIM-CI-T模型,用于典型FPGA与温度效应的IO元素预测

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摘要

In this paper, the electromagnetic interference and temperature coupling on MOS transistor is analyzed. The temperature controlled platform that combined with the standardized direct power injection method is designed for experimental measurement. Then the temperature effect on MOS device is considered into the conducted electromagnetic immunity model of input/output element (IOE) for typical field programmable gate array. Meanwhile, the proposed immunity model ICIM-CI-T (integrated circuits immunity model-conducted immunity-temperature), which is based on ICIM-CI, is built to predict the influence of thermal effect on the electromagnetic immunity of IOE. Finally, the validation of the ICIM-CI-T model is verified by experimental measurements, and both simulation and measurement results fit very well at different temperatures. Moreover, it is also observed that temperature exerts different effects on the immunity characteristic of IOE with the change of radio frequency interference frequency.
机译:在本文中,分析了MOS晶体管上的电磁干扰和温度耦合。与标准化直接电动注入方法相结合的温控平台用于实验测量。然后,对MOS装置的温度效应被认为是输入/输出元件(IOE)的电磁免疫模型,用于典型的场可编程门阵列。同时,建议的ICIM-CI-T(集成电路抗扰度模型 - 导航IMMITE-LEVICE)基于ICIM-CI,以预测热效应对IOE电磁免疫的影响。最后,通过实验测量验证了ICIM-CI-T模型的验证,仿真和测量结果在不同温度下非常适合。此外,还观察到,随着射频干扰频率的变化,温度对IOE的免疫特性产生不同的影响。

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