Maximizing EOS and ESD immunity in high-performance serial buses

摘要

EOS (electrical overstress) and ESD (electrostat-ic discharge) are the main causes of failures inrnsemiconductors. Although EOS often takes the blame, ESD may sometimes accompany EOS.rnDid the assembly machinery zap the part? Didrnthe handling procedures take the proper ESD precautions? Did the test equipment do something to the part? Or did the end user zap the part while crawling on a rug to reach a connector in back of a computer so he could plug in a cable? Figuring out the cause of device failures can present significant challenges. Eliminating the detective work by avoiding the failures is the most cost-effective approach. This article shows how to make pc boards as tolerant as possible of ESD and EOS.