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首页> 外文期刊>International Journal of Engineering Research and Applications >Design of Multilayer Fractal Capacitor in 0.18μm RF CMOS process
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Design of Multilayer Fractal Capacitor in 0.18μm RF CMOS process

机译:0.18μm射频CMOS工艺中多层分形电容器的设计

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In this Paper, Multilayer capacitor is proposed based on chord fractal space filling curvein0.18μm RF CMOS process. The Proposed capacitor uses the both vertical and lateral electric fields. The capacitance density increases as number of layers increases with proper contact of vias in CMOS process. The design strategy is proposed for an on-chip area of 100 × 100 μm2. The Proposed capacitor achieves a 50 % higher capacitance value than the standard chord capacitors of similar on-chip area with a reasonable Q factor and Self resonant frequency for RF applications.
机译:本文基于弦分形空间填充曲线0.18μm射频CMOS工艺提出多层电容器。所提出的电容器使用垂直和横向电场。随着层数增加,电容密度随着CMOS过程中的通孔的适当接触而增加。建议设计策略,用于100×100μm2的片上面积。所提出的电容器比相似的片上区域的标准弦电容器达到50%的电容值,具有合理的Q因子和用于RF应用的自谐振频率。

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