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Elastic anisotropy and thermal conductivity of silicon allotropes

机译:弹性各向异性和硅片同质的热导率

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Silicon is the most basic and commonly used semiconductor material in the modern microelectronics industry. Because diamond silicon is an indirect band gap semiconductor, its application in the optoelectronic industry is limited. Searching for new silicon allotropes with direct band gaps has been a hot topic in the fields of condensed matter and materials science. In this work, the elastic anisotropy and thermal conductivity of seven silicon allotropes with direct band gaps (D76, D63, D135, D243, D12, D239, and D979), a silicon allotrope with quasi-direct band gap (Q135) and a silicon allotrope with indirect band gap (I926) are investigated. The elastic anisotropy of shear modulus, Young’s modulus and Poisson’s ratio for Q135, D76, D63, D135, D243, D12, I926, D239, and D979 silicon allotropes are investigated by surface constructions of the 2D representation. The I926 phase has the greatest thermal conductivity among the nine silicon allotropes, and it is greater than that of the oC12 phase. In addition, the anisotropy of elastic moduli and the anisotropy of thermal conductivity in each main plane for Q135, D76, D63, D135, D243, D12, I926, D239, and D979 are studied for the first time.
机译:硅是现代微电子工业中最基本和常用的半导体材料。因为钻石硅是间接带隙半导体的,所以其在光电工业中的应用是有限的。寻找新的直接频段间隙的新硅同质是在炼细和材料科学领域的热门话题。在这项工作中,具有直接带间隙的七种硅交型的弹性各向异性和导热率(D76,​​D63,D135,D243,D12,D239和D979),具有准直带隙的硅交联(Q135)和硅研究了间接带隙(I926)的同种异体。通过2D表示的表面结构研究了剪切模量,杨氏模量和泊松比对于Q135,D76,D63,D135,D243,D12,I926,D239和D979硅同种异体胶质熵的弹性各向异性。 I926相具有九个硅交滴之间最大的导热性,并且大于OC12相的热导率。另外,第一次研究了Q135,D76,D63,D135,D243,D12,I926,D239和D979各主平面中弹性模量的各向异性和导热率的各向异性。

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