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Optimization of the Tunnel Drying Process of Cassava Chips Using Response Surface Methodology

机译:使用响应表面方法优化木薯片的隧道干燥过程

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Background and Objectives: Nigeria is the one of the largest producers of cassava chip s in the world but the chips that are produced is often of low quality because of inadequate and ineffective methods drying techniques used to produce those chips. This study examined the critical factors in the optimization of the drying process of cassava chip s in order to address the problem of low quality often occur in locally produced chips when compared to foreign ones. Materials and Methods: In this study, response surface methodology was used to investigate the effect of 3 drying factors [temperature (53-86°C), air velocity (0.98-5.0 m secsup?/supsup1/sup) and loading density (3.32-6.68 kg msup?/supsup2/sup)] on the responses using central composite design (CCD). Process responses of the CCD recorded were moisture content , bulk density, water absorption capacity, swelling capacity, residual cyanide and color. Results: The optimum values of moisture content , bulk density, water absorption capacity, swelling capacity, residual cyanide and color were 10.22% (wet basis), 0.39 g cmsup?/supsup3/sup, 4.320 cmsup3/sup gsup?/supsup1/sup sample, 2.26 g gsup?/supsup1/sup water sample, 3.78 mg kgsup?/supsup1/sup HCN sample and 0.25, respectively. Conclusion: Lower temperatures of drying minimally reduced the level of cyanide content and gave finest color to the chips. Contrariwise, higher drying temperatures reduced moisture content and bulk density of the chips.
机译:背景和目标:尼日利亚是世界上最大的木薯芯片生产商之一,但由于使用不足和无效的方法使用用于生产这些芯片的方法,所产生的芯片通常是低质量的。本研究检测了在木薯芯片的干燥过程中优化的关键因素,以解决低质量的问题,通常在局部生产的芯片与外国芯片相比。材料和方法:在本研究中,使用响应面方法来研究3个干燥因子[温度(53-86°C),空气速度(0.98-5.0m秒 的影响使用中央复合设计(CCD)的响应,1 )和装载密度(3.32-6.68 kg m α 2 )]。 CCD记录的过程应答是水分含量,散装密度,吸水能力,溶胀容量,残留的氰化物和颜色。结果:水分含量,散装密度,吸水能力,膨胀容量,残留氰化物和颜色的最佳值为10.22%(湿法),0.39g cm α 3 ,4.320cm 3 g α 1 样品,2.26 gg β 1 水样,3.78mg kg ? 1 hcn样品和0.25分别。结论:干燥温度较低,减少了氰化物含量的水平,并给芯片产生了最佳颜色。相反,较高的干燥温度降低了芯片的水分含量和堆积密度。

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