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首页> 外文期刊>Procedia Computer Science >Analysis of Interface Charge Using Capacitance-Voltage Method for Ultra Thin HfO2 Gate Dielectric Based MOS Devices
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Analysis of Interface Charge Using Capacitance-Voltage Method for Ultra Thin HfO2 Gate Dielectric Based MOS Devices

机译:基于电容电压法的超薄HfO 2 栅介电MOS器件的界面电荷分析

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摘要

In this paper, we have calculated Flatband voltage (V fb ) in terms of interface trap charges, fixed oxide charges and oxide trapped charges for ultra thin oxide Metal Oxide Semiconductor (MOS) Devices using SiO 2 and HfO 2 has been methodically investigated. The interface charges are designed using capacitance-voltage (C-V) method. It indicates that by reducing the oxide thickness, the interface charges increases linearly. It is originated to be in good agreement with ATLAS simulation results at p-type doping level of 1 × 10 17 cm -3 . It has been evaluated that with respect to SiO 2 for the same oxide thickness, HfO 2 contributes less to V fb . Numerical calculations and Analytical solutions are performed by MATLAB and we simulate the capacitance-voltage (C-V) characteristics of the MOS devices with ultrathin oxide using ATLAS, a commercially available TCAD tool from SILVACO. The tool has investigated the effect on C-V characteristics of different oxide thickness of SiO 2 and HfO 2 . Excellent agreement was observed over a wide range of oxide thickness for the materials.
机译:在本文中,我们已经对使用SiO 2和HfO 2的超薄氧化物金属氧化物半导体(MOS)器件的界面陷阱电荷,固定氧化物电荷和氧化物陷阱电荷进行了计算,得出了平坦带电压(V fb)。使用电荷电压(C-V)方法设计接口电荷。这表明通过减小氧化物厚度,界面电荷线性增加。最初与ATLAS模拟结果在1×10 17 cm -3的p型掺杂水平上非常吻合。已经评估出,对于具有相同氧化物厚度的SiO 2,HfO 2对V fb的贡献较小。 MATLAB进行了数值计算和分析解决方案,我们使用SILVACO的TCAD工具ATLAS对超薄氧化物模拟MOS器件的电容-电压(C-V)特性。该工具研究了不同氧化物厚度的SiO 2和HfO 2对C-V特性的影响。在各种材料的氧化物厚度范围内均观察到极好的一致性。

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