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Preparation of Polyacrylonitrile-Kapok Hollow Microtubes Decorated with Cu Nanoparticles

机译:铜纳米粒子修饰的聚丙烯腈-木棉空心微管的制备

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A novel copper (Cu) nanoparticle carrier was fabricated using kapok natural microtubes as a substrate. Cu nanoparticles were grown on a thin polymer film on the surface of the kapok fibers. The polymer film was deposited on the surface of the microtube using a surfactant-assisted polymerization of acrylonitrile monomers. Cetyltrimethyl ammonium bromide (CTAB) was used surfactant. The contact angle decreased from 120.5 to 0 after polyacrylonitrile coating (PAN), which suggests improved hydrophilicity of the kapok fibers. Addition of 1.5 mL acrylonitrile and 0.020 – 0.035 g CTAB yielded evenly coated kapok fibers. Cu nanoparticles, with diameters of 82-186 nm, were formed on the surface of the composite by reducing 0.16 M copper sulphate (CuSO4) with hydrazine (N2H4) at 70°C. EDX reveals that more Cu nanoparticles formed on the surface of PAN-kapok composites with 0.035g CTAB due to thicker PAN coating.
机译:一种新型的铜(Cu)纳米粒子载体是用木棉天然微管作为基材制备的。 Cu纳米颗粒生长在木棉纤维表面的聚合物薄膜上。使用表面活性剂辅助的丙烯腈单体聚合将聚合物膜沉积在微管的表面。十六烷基三甲基溴化铵(CTAB)用作表面活性剂。聚丙烯腈涂层(PAN)后,接触角从120.5减小到0,这表明木棉纤维的亲水性得到改善。添加1.5 mL丙烯腈和0.020 – 0.035 g CTAB可以得到均匀包覆的木棉纤维。通过在70°C用肼(N2H4)还原0.16 M硫酸铜(CuSO4),在复合材料表面上形成直径为82-186 nm的Cu纳米粒子。 EDX显示,由于PAN涂层较厚,在具有0.035g CTAB的PAN-木棉复合材料表面上形成了更多的Cu纳米颗粒。

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