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Effect of Pad Elastic Modulus on The Polishing Induced Plastic Subsurface Damages Distribution of Fused Silica Optics

机译:垫板弹性模量对熔融石英光学元件抛光诱导的塑料次表面损伤分布的影响

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The plastic subsurface damages distribution of fused silica optics polished with different pads are investigated. The elastic interaction model, plastic indentation model and wear relationships are combined together to theoretically characterize the plastic subsurface damages distribution in different polishing processes, which shows consistent results with experiments. It reveals that most of the polishing induced subsurface damages are plastic damages. A few largest polishing particles in the tail end distribution mainly decide the final depth distribution and density of the polishing induced plastic subsurface damages. The larger pad elastic modulus will make the few largest polishing particles bear much larger load and generate larger proportion of observable plastic subsurface damages. Using polishing pad with lower elastic modulus is prominent for restricting the generation of fractures and plastic damages.
机译:研究了用不同垫抛光的熔融石英光学元件的塑料次表面损伤分布。将弹性相互作用模型,塑性压痕模型和磨损关系结合在一起,从理论上表征了不同抛光过程中塑性亚表面损伤的分布,与实验结果相吻合。它表明,大多数抛光引起的表面损伤是塑性损伤。尾端分布中的几个最大的抛光颗粒主要决定了最终深度分布和抛光引起的塑料次表面损伤的密度。较大的垫板弹性模量将使少数几个最大的抛光颗粒承受更大的载荷,并产生较大比例的可观察到的塑料次表面损伤。使用具有较低弹性模量的抛光垫对于限制断裂和塑性损伤的产生是突出的。

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